SIA448DJ-T1-GE3【PDF 1/9 页】MOSFET N-CH 20V D-S SC70-6L

收藏本站

您好，
买卖IC网欢迎您。
请登录
免费注册

买卖IC网

Sheet目录514

[1页]2页 3页 4页 5页

New Product

SiA448DJ

Vishay Siliconix

N-Channel 20 V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

? TrenchFET ? Power MOSFET

V DS (V)

R DS(on) ( ? ) Max.

0.0150 at V GS = 4.5 V

0.0166 at V GS = 2.5 V

0.0200 at V GS = 1.8 V

0.0324 at V GS = 1.5 V

I D (A)

Q g (Typ.)

13 nC

? New Thermally Enhanced PowerPAK ?

SC-70 Package

- Small Footprint Area

- Low On-Resistance

? 100 % R g Tested

? Material categorization: For definitions of

compliance please see www.vishay.com/doc?99912

PowerPAK SC-70-6L-Sin g le

APPLICATIONS

Markin g Code

? For Smart Phones and Mobile

Computing

AQX

- Load Switches

Part # code

XXX

- DC/DC Converters

2.05 mm

Lot Tracea b ility

and Date code

Orderin g Information:

SiA44 8 DJ-T1-GE3 (Lead (P b )-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)

N-Channel MOSFET

Parameter

Drain-Source Voltage

Gate-Source Voltage

T C = 25 °C

Symbol

V DS

V GS

Limit

±8

12 a

Unit

Continuous Drain Current (T J = 150 °C) a

Pulsed Drain Current (t = 300 μs)

Continuous Source-Drain Diode Current

T C = 70 °C

T A = 25 °C

T A = 70 °C

T C = 25 °C

T A = 25 °C

T C = 25 °C

I D

I DM

I S

12 a

12 a, b, c

9.9 b, c

12 a

2.9 b, c

19.2

Maximum Power Dissipation

T C = 70 °C

T A = 25 °C

P D

12.3

3.5 b, c

T A = 70 °C

2.2 b, c

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature) d, e

T J , T stg

- 55 to 150

260

°C

THERMAL RESISTANCE RATINGS

Parameter

Symbol

Typical

Maximum

Unit

Maximum Junction-to-Ambient b, f

Maximum Junction-to-Case (Drain)

t ? 5s

Steady State

R thJA

R thJC

5.3

6.5

°C/W

Notes:

a. Package limited

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile ( www.vishay.com/doc?73257 ). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 80 °C/W.

Document Number: 63918

S12-1138-Rev. A, 21-May-12

For technical questions, contact: pmostechsupport@vishay.com

www.vishay.com

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

*型号	*数量	厂商	批号	封装

添加更多采购

采购需求

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

我的联系方式